- Türkçe
EMB-R388000NN-A2-S motherboard uses the RK3568 quad-core ARM Cortex-A55 architecture CPU, with a maximum dominant frequency of 2.0GHz. Integrated ARM Mali-G52 GPU. Support OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1. Embedded high-performance 2D acceleration hardware. NPU supports 1T computing power, 4K and 2K video playback, 4K 60fps H.265/H.264/VP9 video decoding, 1080P 60fps H.265/H.264, video encoding, and HDR. Support multiple screen show, show support MIPI/ LVDS, chip support USB2.0/USB3.0/PCIE3.0 / PCIE2.1 / QSGMII interface.
| Product Introduce | |
| Operating System | Linux/Android |
| CPU | RK3568 ARM quad-core ARM Cortex-A55, Highest frequency is 2.0GHz,Arm Mali-G52 GPU is embedded with High-performance 2D acceleration hardware, 4K H.265 and other decoding methods |
| Memory | 2GB LPDDR4+8GB EMMC |
| TYPE-C USB | OTG |
| Display interface | HDMI*1 support 1080P@120Hz OR 4K@60Hz LVDS*1, MIPI_DSI/LVDS*1, EDP*1 |
| Camera interface | MIPI*1 |
| Ethernet | LAN*2 |
| I/O interface | WIFI, BT, SIM card (nano) , TF card, RS232(DB9)*1, RS485*1, USB 3.0*1, CAN*1, RS232 COM*3, USB*4 |
| Power Supply | DC-in |
| 9-30V Typ. 12V | |
| Power Consumption | 4W(Static desktop with default brightness) |
| System upgrade | Support local USB upgrade |
| System Language | Multilingualism |
| Mechanical | 170.00*96.60*22.10 mm |
| Weight | 150g |
| No. | Item | Symbol | ||||||
| 1 | DC | Power DC 12V | ||||||
| 2 | HDMI | HDMI 2.0 | ||||||
| 3 | USB | USB3.0*1 TYPE-C OTG*1 | ||||||
| 4 | LAN | LAN*2 10/100/1000M | ||||||
| 5 | SIM CARD | 4G LTE | ||||||
| 6 | TF CARD | TF card slot | ||||||
| Item | Symbol | Min. | Max. | Unit | |||||
| Operation Temperature | Top | 0 | +60 | °C | |||||
| Storage Temperature | Tst | -20 | +70 | °C | |||||
| Humidity | RH | – | 90% | %RH | |||||
| 6.RELIABILITY TEST CONDITIONS | |||||||||
| No. | Test Item | Test condition | Inspection after test | ||||||
| 1 | High Temperature Storage Test | +70°C/72 hours | Inspection after 2~4 hours storage at room temperature, the sample shall be free from defects : 1.Current changing value before test and after test is 50% larger. 2. Function defect : Non-display, abnormal-display 3.Visual defect : Glass crack. |
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| 2 | Low Temperature Storage Test | -20°C/120 hours | |||||||
| 3 | High Temperature Operating Test | +60°C/48 hours | |||||||
| 4 | Low Temperature Operating Test | 0°C/120 hours | |||||||
| 5 | Temperature Cycle Storage Test | -20°C ~ 25°C ~ +70°C/10 cycles | |||||||
| (30 min.) (10 min.) (30 min.) | |||||||||
| 6 | High Temperature High Humidity | +50°C*90% RH/120 hours | |||||||
| Test | |||||||||
| Frequency : 250 r/min | |||||||||
| 7 | Vibration Test | Amplitude : 1 inch | |||||||
| Time: 45 min | |||||||||
| Drop direction: | |||||||||
| 1 corner/3 edges/6 sides ,10 | |||||||||
| times | |||||||||
| Packing | Drop height(cm) | ||||||||
| 8 | Drop Test | weight(kg) | |||||||
| <11 | 80±1.6 | ||||||||
| 11≦G<21 | 60±1.2 | ||||||||
| 21≦G<31 | 50±1.0 | ||||||||
| 31≦G<40 | 40±0.8 | ||||||||
| Air discharge: ±8 KV, 10 times | |||||||||
| 9 | ESD Test | Contact discharge: ±4 KV, 10 | |||||||
| times | |||||||||